Secure ventilation through protective flexible sensors

ABSTRACT

A tamper detection system may include organic material and a tamper detection circuit embedded in the organic material. A portion of the organic material is ablated away to form an incision in the organic material. A portion of the tamper detection circuit obstructs a fragment of the ablation path. The tamper detection circuit remains intact. The incision enables a gas flow between a first side of the organic material and a second side of the organic material.

BACKGROUND

The present disclosure relates to secure enclosures and morespecifically to securing enclosures requiring ventilation.

Secure enclosures may be used to protect contents such as data and/ormachinery. Some secure enclosures require ventilation to allow pressurerelease from inside the secured enclosure. Pressure inside a secureenclosure can result in false tamper detections which may causeunnecessary downtime of related systems. Various constraints of thesecure module system, such as physical and mechanical constraints, maymake it difficult to include ventilation in secure module enclosureswhile maintaining the security of the enclosure.

SUMMARY

Embodiments of the present disclosure include a system, method, andcomputer program product for tamper detection. A tamper detection systemmay include organic material and a tamper detection circuit embedded inthe organic material. A portion of the organic material is ablated awayto form an incision in the organic material. A portion of the tamperdetection circuit obstructs a fragment of the ablation path. The tamperdetection circuit remains intact. The incision enables a gas flowbetween a first side of the organic material and a second side of theorganic material.

The above summary is not intended to describe each illustratedembodiment or every implement of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The drawings included in the present application are incorporated into,and form part of, the specification. They illustrate embodiments of thepresent disclosure and, along with the description, serve to explain theprinciples of the disclosure. The drawings are only illustrative ofcertain embodiments and do not limit the disclosure.

FIG. 1 illustrates a secure ventilation system in accordance with someembodiments of the present disclosure.

FIG. 2 depicts a material with a secure ventilation mechanism inaccordance with some embodiments of the present disclosure.

FIG. 3 illustrates a material undergoing a secure ventilation process inaccordance with some embodiments of the present disclosure.

FIG. 4 depicts a material with secure ventilation in accordance withsome embodiments of the present disclosure.

FIG. 5 illustrates a material with secure ventilation in accordance withsome embodiments of the present disclosure.

FIG. 6 depicts a schematic of materials with secure ventilation inaccordance with some embodiments of the present disclosure.

FIG. 7 illustrates a system utilizing material with secure ventilationin accordance with some embodiments of the present disclosure.

FIG. 8 depicts a schematic of a material with secure ventilation inaccordance with some embodiments of the present disclosure.

FIG. 9 illustrates a system utilizing material with secure ventilationin accordance with some embodiments of the present disclosure.

FIG. 10 depicts a high-level block diagram of an example computer systemthat may be used in implementing one or more of the methods, tools, andmodules, and related functions in accordance with some embodiments ofthe present disclosure.

While the invention is amenable to various modifications and alternativeforms, specifics thereof have been shown by way of example in thedrawings and will be described in detail. It should be understood,however, that the intention is not to limit the invention to theparticular embodiments described. On the contrary, the intention is tocover all modifications, equivalents, and alternatives falling withinthe spirit and scope of the invention.

DETAILED DESCRIPTION

Aspects of the present disclosure relate to secure enclosures and morespecifically to securing enclosures requiring ventilation.

Secure enclosures are used to protect contents within the enclosure.Some secure enclosures require a mechanism to relieve pressure that maybuild up within the secured enclosure which, unless effectivelymitigated, may result in false tamper detections. Constraints may makeit difficult to ventilate a secure enclosure while maintaining theability of the enclosure to detect and/or discourage tampering.

The present disclosure includes a tamper detection circuit embedded inorganic material such that part of the organic material is ablated awayto generate a passage from one side of the material to the other side ofthe enclosure, enabling ventilation while simultaneously maintaining thetamper detection circuit. A tamper detection system in accordance withthe present disclosure may include organic material and a tamperdetection circuit embedded in the organic material. A portion of theorganic material is ablated away to form an incision in the organicmaterial. A portion of the tamper detection circuit obstructs a fragmentof the ablation path. The tamper detection circuit remains intact, andthe incision enables the flow of gaseous matter between a first side ofthe organic material and a second side of the organic material.

The present disclosure includes a method for manufacturing a tamperdetection system. The method may include obtaining a tamper detectioncircuit embedded in an organic material and ablating a segment of theorganic material to form an incision. Ablating the incision may removeorganic material in an ablation path. A portion of the tamper detectioncircuit may obstruct part of the ablation path. The tamper detectioncircuit remains intact, and the incision enables a gas flow between afirst side of the organic material and a second side of the organicmaterial.

FIG. 1 illustrates a secure ventilation system 100 in accordance withsome embodiments of the present disclosure. A top view 100 a and a sideview 100 b of the secure ventilation system 100 are provided.

The secure ventilation system 100 includes an organic substrate 112, aninorganic tamper detection circuit 114, and an aperture 116. The organicsubstrate 112 may be any organic material, and the tamper detectioncircuit 114 is suspended therein. The tamper detection circuit 114 maybe any metal capable of conducting electrical impulses such that it mayidentify tampering. The organic substrate 112 may include, for example,a polyimide substrate. The tamper detection circuit may include, forexample, copper.

The aperture 116 enables the ventilation of the system such that itpermits the flow of fluids between a first side and a second side of thesystem 100. The aperture 116 is formed through the organic substrate 112and leaves the tamper detection circuit 114 intact. The aperture 116 maybe formed by any means which will permit the ablation of the organicmaterial without harming the electrical integrity of the tamperdetection circuit such that an incision may be formed to fluidly connectone side of the system 100 to the other side of the system 100.

Methods that may be used to form the aperture 116 may include, forexample, laser ablation and/or chemical ablation. Laser ablation may beused by tuning a laser to ablate the specific organic material used inthe organic substrate 112 while not interfering with the tamperdetection circuit 114. Chemical ablation may similarly be used bydirecting chemicals suited to ablating organic material to the substrateto form the desired aperture 116.

In some embodiments, laser ablation may be preferred because a laser maybe easier to control the precise outcome of. For example, in someembodiments, a certain angle of the aperture (rather than directlyvertical) may be preferred, and the laser may be capable of preciseangling. Moreover, using a laser may enable a shadow effect such thatsubstrate behind a portion of the tamper detection circuit 114 may beprotected from ablation; in some cases, this may help to prevent thetamper detection circuit 114 from shorting.

FIG. 2 depicts a material 200 with a secure ventilation mechanism inaccordance with some embodiments of the present disclosure. The material200 is shown in a first environment 202, a second environment 204, and athird environment 206. In each environment, a side schematic view 222 a,224 a, and 226 a is shown as well as a top view 222 b, 224 b, and 226 b.

In the first environment 202, a light source 212 is applied over the topof the material 200 as shown in the side view 222 a. The top view 222 bshows the visibility of the planned incision location in the materialunder the conditions of the first environment 202. With the light source212 applied over the material 200, the incision is not obvious and, insome cases, may be invisible to the naked eye. This ability of theincision to be generally invisible increases security as no weaknessesin the material are made obvious by the ventilation mechanism. Further,because in some embodiments the only way to apply a light source to thematerial 200 would be with an overhead-oriented light source 212, theventilation system would be generally invisible to an ob server.

In the second environment 204, a light source 214 is applied underneaththe material 200 as shown in the side view 224 a. The top view 224 bshows the visibility of the planned incision location in the materialunder the conditions of the second environment 202. With the lightsource 214 applied underneath the material, the incision is not obviousbecause it appears similar to the other spaces between the coppertraces. In other words, it is not visibly distinct from the segments ofthe material 200 that retain the organic substrate. Thus, again, theincision is not made vulnerable.

In the third environment 206, light sources 216 and 216 b are appliedboth over and underneath the material 200 as shown in the side view 226a. The top view 226 b shows the visibility of the planned incisionlocation in the material under the conditions of the second environment202. With the light sources 216 a and 216 b applied both over andunderneath the material, similar to when the light source 214 wasapplied only underneath the material, the incision is not obviousbecause it appears similar to the other spaces between the coppertraces. In other words, it is not visibly distinct from the segments ofthe material 200 that retain the organic substrate. Thus, again, theincision is not particularly vulnerable and is protected from anobserver identifying a potential weakness in the system.

In some embodiments, the incision may be formed by exposing the tamperdetection circuit embedded in the organic material to an organic matterelimination mechanism. The organic matter elimination mechanismeliminates organic matter and does not eliminate inorganic matter. Insome embodiments, the organic matter elimination mechanism may be alaser tuned to ablate the organic material while not adversely affectingthe tamper detection circuit such that the organic material in a drillpath of the laser is removed and the tamper detection circuit in thedrill path of the laser remains intact.

FIG. 3 illustrates a material 300 undergoing a secure ventilationprocess in accordance with some embodiments of the present disclosure.More specifically, the material 300 is shown in a first state 302. Inthe first state 302, the material 300 has been identified to be used forimplementation of the secure ventilation system, and the location of theablation for ventilation has been identified. The second state 304 showsthe material 300 after the incision has been made by ablating away theorganic material in the drill path of the laser used to ablate theincision in the material 300.

In many applications, it is preferable to use laser ablation of theorganic material because of the ability to precisely decide the shape ofthe drill path and thus the shape of the incision. A laser should beproperly tuned to the specific components (e.g., the substrate and thetamper detection circuit) in the material to be used for ventilation aswell as the use case. Tuning the laser to the specific components in thematerial allows the laser to ablate the organic material while leavingthe tamper detection unit intact. Specifically, the electrical integrityof the substrate is to remain intact to enable the material to remaincapable of performing sensing detection.

In some embodiments, a multilayer polyimide substrate with copper tracesmay be used as the secure ventilation material. The copper traces may bereferred to as the secure mesh because the copper traces form the tamperdetection circuit. In some embodiments, a laser may be used to remove(or laser ablate) the organic material. Various laser wavelengths, fromultraviolet to infrared wavelengths, may be used to laser ablate theorganic material while leaving the security traces intact. Similarly,various laser pulse widths, from continuous wave (CW) to femtosecondpulses, may be used to laser ablate the organic material while leavingthe security traces intact.

In some embodiments, a radio frequency (RF) laser may be used to ablatethe organic material (such as a polyimide substrate) while leaving thetamper detection circuit (such as copper traces) intact. The RF lasermay be tuned to a wavelength of 1035 nm, a pulse width of 300 fsec, anamplifier of 1 MHz, a divided mode of 5, a pulse repetition rate (pulserep rate, or PRR) of 200 KHz, and an RF of 30. The specifications fortuning the laser to other specifications according to the materials usedin other embodiments will be recognized by those with skill in the art.

Similarly, the scanner can be set to certain specifications to optimizethe performance of the laser ablating the material. In the embodimentreferenced above with the polyimide substrate, copper traces, and RFlaser, the scanner may be set to a scan speed of 1 M/s, a line spacingof 0.05 mm, and a 10-15 μm (FWHM). Desired scanner specifications forother embodiments will be recognized by those of skill in the art.

FIG. 4 depicts a material 400 with secure ventilation in accordance withembodiments of the present disclosure. The material 400 was ablated by alaser on a first side 402 a such that the incision traverses theentirety of the material. The incision is therefore visible on thesecond side 402 b of the material 400. The force of the laser ablatingthe first side 402 a of the material may leave an ablation slope betweenthe incision and the surrounding parts of the material 400.

The width of the drill path of a laser used to ablate the material, andthereby the width of an incision made by the laser in the material, mayvary. The width of the incision may impact other factors associated withthe ventilation system; specifically, the length of processing timerequired, the amount of fluid flow through the incision, and how thematerial is ablated may vary, among other factors. In one embodiment, aventilation incision may be formed by using a laser to drill a 100 μmdiameter through hole in less than four (4) seconds of processing time.In another embodiment, a large ventilation incision (as shown, e.g., inFIG. 5 ) may have an ablated region with a large width and with thelaser ablating from both a first side and a second side to ablate theorganic matter within the ablation region to expose through holesbetween the tamper detection component; more processing time may berequired for such an embodiment.

FIG. 5 illustrates a material 500 with secure ventilation in accordancewith some embodiments of the present disclosure. Material 500 has alarge ventilation incision. Material 500 is shown from a first side 502a and a second side 502 b. The incision is started on the first side 502a to start the vent and penetrate halfway through material 500. Theincision is then finished from a second side 502 b by penetrating therest of the way through material 500 to form the vent. The material 500shown uses a polyimide substrate as the organic material and coppertraces as the tamper detection circuit. The copper traces are visible inthe ablation crisscrossing over one another. Through holes are visiblebetween the copper traces. At these through holes, the polyimidesubstrate was ablated away by a laser to enable ventilation whilepreserving the electrical integrity of the detection circuit.

In some embodiments, a large ventilation incision may have an ablatedregion with a width of 1.5 mm with the laser ablating from both a firstside (e.g., the side adjacent the protected assets) and a second side(e.g., the externally-facing side) to ablate the organic matter (e.g.,the substrate, such as a polyimide substrate) within the ablation regionto expose through holes between the tamper detection component (e.g.,the copper traces). In such embodiments, the laser is tuned to removethe substrate without negatively impacting the tamper detection circuitsuch that spaces between the tamper detection circuit may be ablatedaway to enable ventilation whereas the electrical integrity of thetamper detection circuit may remain intact.

In some embodiments, maintaining organic material between tamper sensortraces may prevent shorting of the tamper detection system. Laserablation of a material in accordance with embodiments of the disclosuremay leave a shadow behind areas of tamper detection circuit. Forexample, if a laser ablates away the polyimide substrate and not thecopper traces, any copper traces overlaying polyimide substrate willshield the overlaid polyimide substrate from ablation. In other words, alaser tuned to ablate organic matter will not ablate the organic matterbehind intervening inorganic matter. The organic matter between tampersensor traces is thus preserved using this technique.

FIG. 6 depicts a schematic of materials 600 with secure ventilation inaccordance with some embodiments of the present disclosure. Theschematic of materials 600 shows a first segment 610 of secureventilation material and a second segment 620 of secure ventilationmaterial. The first segment 610 includes organic material 612 (e.g., apolyimide substrate) and traces 614 (e.g., copper) of a tamper detectionsystem.

The first segment 610 includes a first incision 616 a and a secondincision 616 b. Incisions may be vertical, angled, cornered, or somecombination thereof. The incisions must connect a first side (e.g., sidefacing protected assets) to a second side (e.g., externally-facing side)to enable ventilation (e.g., the flow of gas from one side to theother). In the first segment 610, the first incision 616 a is a straightvertical incision. The second incision 616 b is an angled incision. Insome embodiments, an angled incision such as the second incision 616 bmay be preferred to increase the difficulty of succeeding inunauthorized access of protected assets.

In some embodiments, the incision may be formed by ablating the materialmultiple times. A first ablation may be laser-drilled on the first sideof the organic material and a second ablation may be laser-drilled onthe second side of the organic material. In some embodiments, an angleof the incision formed by the first ablation and the second ablation isbetween 60° and 120°. The angle of the incision may be where the twoablations meet or intersect.

The second segment 620 of secure ventilation material has organicmaterial 622 (e.g., a polyimide substrate) and traces 624 (e.g., copper)of a tamper detection system. The second segment 620 includes a firstincision 626 a, a second incision 626 b, and a third incision 636 c. Thefirst incision 626 a is a vertical incision, the second incision 626 bis an angled incision, and the third incision 626 c is a corneredincision.

In FIG. 6 , the vectors (the straight parts of the incision) of thethird incision 626 c meet approximately at a right angle (90° angle).Other meeting angles may be used in accordance with the presentdisclosure as long as ventilation is facilitated between the first sideof the material and the second side of the material. For example, insome embodiments, a 35° meeting angle may be preferred whereas in otherembodiments a meeting angle of 155° may be preferred. In someembodiments of the present disclosure, a precise 90° angle may bepreferred; in some embodiments of the disclosure, a range of 60° to 120°meeting angle may be preferred.

Some embodiments may employ multiple cornered incisions. Suchembodiments may use the same meeting angle throughout the ventilatedmaterial. For example, all incision vectors may meet at approximately an85° angle. Such embodiments may vary the incision meeting angles. Forexample, a material with three ventilation incisions may have meetingangles of 102°, 93°, and 24°. Some embodiments may use a combination ofunique and replicated meeting angles. For example, a material with fourventilation incisions may have meeting angles of 102°, 93°, 24°, and93°.

Ventilation incisions may be used once or multiple times in a material.In some embodiments, the ventilating material may be a relatively smallcomponent of a secure system. For example, the ventilating material maybe embedded in a mechanical can such that there is an opening throughthe mechanical can on either side of the incision openings; in such anembodiment, it may be preferable to have few incisions (e.g., only one)to minimize the proper opening in the mechanical can. In someembodiments, the ventilating material may be affixed onto the mechanicalcan rather than affixed inside it; in such embodiments, it may bepreferable to have a few incisions (e.g., three) to minimize the size ofthe opening in the mechanical can while maximizing the ventilationcapability of the opening.

In some embodiments, the ventilating material may form the entire secureenclosure. For example, the ventilating material may form a spheresurrounding a polygonal orb suspending a protected asset using magnetsaffixed to the inside of the triagonal junctions of the polygon. Such anembodiment may use several incisions (e.g., one over the center ofvarious lines in the polygon) to ventilate the protected asset.

In some embodiments, the organic material and the tamper detectioncircuit embedded in the organic material may fully encapsulate aprotected volume. Some embodiments of a tamper detection system mayfurther include a mechanical can. The mechanical can may include amechanical opening. The tamper detection circuit embedded in the organicmaterial may be affixed over the mechanical opening of the mechanicalcan. In some embodiments, a tamper detection method in accordance withthe present disclosure may include affixing the tamper detection circuitembedded in the organic material to a mechanical can. The mechanical canmay include a mechanical opening, and the tamper detection circuitembedded in organic material may be affixed over the mechanical openingof the mechanical can.

FIG. 7 illustrates a system 700 utilizing material with secureventilation in accordance with some embodiments of the presentdisclosure. A first viewpoint is shown of a cross-sectional view 700 aof the system 700 and a second viewpoint is shown of a top-down view 700of the system 700.

The system 700 includes a mechanical can 702 connecting to a circuitboard 704 around a protected asset 706. The mechanical can 702 has amechanical opening 712. The mechanical opening 712 may be, for example,a hole through the mechanical can 702. Ventilating material 714 isattached to the mechanical can 702 on the side with the protected asset706. The system 700 further includes a tamper sensor 716 extendingaround the entire inside perimeter of the mechanical can 702.

In this embodiment, the ventilating material 714 is on the protectedasset 706 side of the tamper sensor 716. In other embodiments, theventilating material 714 may be between the tamper sensor 716 and themechanical can 702 or integrated as a cohesive unit with the tampersensor 716. For example, the tamper sensor 714 may be embedded in theorganic matter in the ventilating material 714; in such an embodiment,the organic matter of the ventilating material may cover a portion orthe entirety of the tamper sensor 716.

The system 700 is also shown with a top-down view 700 b. The top-downview 700 b shows the mechanical can 702, the circuit board 704, and thetamper sensor 716 through the mechanical opening 712 in the mechanicalcan 702. The top-down view 700 b shows a second mechanical opening 712in the mechanical can 702. In this embodiment, the tamper sensor 716extends around the entire protected asset; as such, the tamper sensor716 is visible through both the mechanical opening 712 and the secondmechanical can opening 722.

In some embodiments, the tamper detection system may further include awire trap affixed to the first side of the organic material adjacent theincision. The wire trap may include a tamper detection sensor and a bondcomponent. The tamper detection sensor may be attached to the organicmaterial via the bond component. The bond component may physicallyseparate the tamper detection sensor from the organic material.

FIG. 8 depicts a schematic of material 800 with secure ventilation inaccordance with some embodiments of the present disclosure. Theschematic of material 800 shows a wire trapped ventilation material 810as well as a sliced side view 820 a and a top view 820 b of the wiretrap 820. The wire trapped ventilation material 810 includes organicmaterial 812 and tamper detection traces 814. The wire trappedventilation material 810 includes an angled ventilation incision 816.The wire trapped ventilation material 810 further includes a wire trap820.

The wire trap 820 is shown with a sliced side view 820 a and a top view820 b. The wire trap 820 has a tamper sensor 824. The tamper sensor 824may include a solid metal plate or copper weave as part of a tamperdetection circuit. In some embodiments, the tamper sensor 824 mayinclude a solid segment of non-breathable material (e.g., a copperplate) because ventilation may occur around the bond component 828. Thebond component 828 may physically separate the wire trap 820 from therest of the ventilation material 810 such that fluids (e.g., air) mayflow between the wire trap 820 and the rest of the ventilation material810.

In this embodiment, the tamper sensor 824 is on an organic base 822(e.g., a polyimide substrate). In some embodiments, the tamper sensor824 may exist independent of an organic base 822.

The top view 820 b of the wire trap 820 shows that the bond component828 is in an L-shape on the tamper sensor 824. The bond component 828may be in any shape that permits the flow of fluids between the wiretrap 820 and the rest of the ventilation material 810. For example, insome embodiments, the bond component 820 may include one or more pillarsof bonding segments that connect the tamper sensor 824 to the rest ofthe ventilation material 810.

FIG. 9 illustrates a system 900 utilizing material with secureventilation in accordance with some embodiments of the presentdisclosure. The system 900 includes a mechanical can 902 connecting to acircuit board 904 around a protected asset 906. The mechanical can 902has a mechanical opening 912. The system 900 further includes a tampersensor 916 extending around the entire inside perimeter of themechanical can 902. Ventilating material 914 is attached to themechanical can 902 on the side with the protected asset 906. A wire trap918 is attached to the ventilating material 914 between the ventilatingmaterial 914 and the protected asset 906.

FIG. 10 depicts a high-level block diagram of an example computer systemthat may be used in implementing one or more of the methods, tools, andmodules, and related functions in accordance with some embodiments ofthe present disclosure. It should be understood in advance that thecomponents, layers, and functions shown in FIG. 10 are intended to beillustrative only and embodiments of the disclosure are not limitedthereto. As depicted below, the following layers and correspondingfunctions are provided.

Hardware and software layer 1015 includes hardware and softwarecomponents. Examples of hardware components include: mainframes 1002;RISC (Reduced Instruction Set Computer) architecture-based servers 1004;servers 1006; blade servers 1008; storage devices 1011; and networks andnetworking components 1012. In some embodiments, software components mayinclude network application server software 1014. The hardware andsoftware layer 1015 may further include a tamper detection system withsecure ventilation 1016.

Virtualization layer 1020 provides an abstraction layer from which thefollowing examples of virtual entities may be provided: virtual servers1022; virtual storage 1024; virtual networks 1026, including virtualprivate networks; virtual applications and operating systems 1028; andvirtual clients 1030.

In one example, management layer 1040 may provide the functionsdescribed below. Resource provisioning 1042 provides dynamic procurementof computing resources and other resources that are utilized to performtasks within the cloud computing environment. Metering and pricing 1044provide cost tracking as resources and are utilized within the cloudcomputing environment as well as billing or invoicing for consumption ofthese resources. In one example, these resources may include applicationsoftware licenses. Security provides identity verification for cloudconsumers and tasks as well as protection for data and other resources.User portal 1046 provides access to the cloud computing environment forconsumers and system administrators. Service level management 1048provides cloud computing resource allocation and management such thatrequired service levels are met. Service level agreement (SLA) planningand fulfillment 1050 provide pre-arrangement for, and procurement of,cloud computing resources for which a future requirement is anticipatedin accordance with an SLA.

Workloads layer 1060 provides examples of functionality for which thecloud computing environment may be utilized. Examples of workloads andfunctions which may be provided from this layer include: mapping andnavigation 1062; software development and lifecycle management 1064;virtual classroom education delivery 1066; data analytics processing1068; transaction processing 1070; and a tool for generating data 1072.

Although the present disclosure has been described in terms of specificembodiments, it is anticipated that alterations and modification thereofwill become apparent to the skilled in the art. The descriptions of thevarious embodiments of the present disclosure have been presented forpurposes of illustration but are not intended to be exhaustive orlimited to the embodiments disclosed. Many modifications and variationswill be apparent to those of ordinary skill in the art without departingfrom the scope and spirit of the described embodiments. The terminologyused herein was chosen to best explain the principles of theembodiments, the practical application, or the technical improvementover technologies found in the marketplace or to enable others ofordinary skill in the art to understand the embodiments disclosedherein. Therefore, it is intended that the following claims beinterpreted as covering all such alterations and modifications as fallwithin the true spirit and scope of the disclosure.

What is claimed is:
 1. A tamper detection system, said systemcomprising: organic material; and a tamper detection circuit embedded insaid organic material, wherein a portion of said organic material isablated away to form an incision in said organic material, wherein aportion of said tamper detection circuit obstructs a fragment of saidablation path, wherein said tamper detection circuit remains intact, andwherein said incision enables a gas flow between a first side of saidorganic material and a second side of said organic material, wherein:said incision is formed by exposing said tamper detection circuitembedded in said organic material to an organic matter eliminationmechanism, wherein said organic matter elimination mechanism eliminatesorganic matter while not eliminating inorganic matter.
 2. The tamperdetection system of claim 1 further comprising: a wire trap affixed tosaid first side of said organic material adjacent said incision, whereinsaid wire trap comprises a tamper detection sensor and a bond component,wherein said tamper detection sensor is attached to said organicmaterial via said bond component, and wherein said bond componentphysically separates said tamper detection sensor from said organicmaterial.
 3. The tamper detection system of claim 1 wherein: saidincision is formed by ablating said material multiple times, wherein afirst ablation is laser-drilled on said first side of said organicmaterial and wherein a second ablation is laser-drilled on said secondside of said organic material.
 4. The tamper detection system of claim 3wherein: an angle of said incision formed by said first ablation andsaid second ablation is between 60° and 120°.
 5. The tamper detectionsystem of claim 1 wherein: said organic matter elimination mechanism isa laser tuned to ablate said organic material while not adverselyaffecting said tamper detection circuit, wherein said organic materialin a drill path of said laser is removed, and wherein said tamperdetection circuit in said drill path of said laser remains intact. 6.The tamper detection system of claim 1 further comprising: a mechanicalcan, wherein said mechanical can includes a mechanical opening, andwherein said tamper detection circuit embedded in said organic materialis affixed over said mechanical opening of said mechanical can.
 7. Thetamper detection system of claim 1 wherein: said organic material andsaid tamper detection circuit embedded in said organic material fullyencapsulate a protected volume.